DIP package is the abbreviation of dual inline package, also known as dual in-line package technology, dual in-line package, a component packaging form of DRAM. Refers to integrated circuit chips packaged in dual inline form. Most small and medium-sized integrated circuits adopt this packaging, with a general number of pins not exceeding 100.

introduce

The CPU chip packaged with DIP has two rows of pins that need to be inserted into a chip socket with DIP structure. Of course, it is also possible to directly insert circuit boards with the same number of solder holes and geometric arrangement for welding. When inserting and unplugging DIP packaged chips from the chip socket, be particularly careful to avoid damaging the pins. DIP packaging structures include: multi-layer ceramic dual inline DIP, single-layer ceramic dual inline DIP, lead frame DIP (including glass ceramic sealing type, plastic packaging structure type, ceramic low melting point glass packaging type), etc.

features

Suitable for perforation welding on PCB (printed circuit board), easy to operate.

The ratio of chip area to packaging area is large, so the volume is also large.

The earliest CPUs such as 4004, 8008, 8086, and 8088 were all packaged using DIP. Through DIP packaging, two rows of pins can be inserted into slots on the motherboard or soldered onto the motherboard.

In the era when memory particles were directly inserted into the motherboard, DIP packaging was once very popular. DIP also has a derivative method, SDIP (Shrink DIP), which has a pin density six times that of DIP.

DIP is also the abbreviation of Dip switch. Its electrical characteristics are:

1. Electrical life: Each switch can be tested at a voltage of 24VDC and a current of 25mA, and can be moved back and forth 2000 times;

2. Rated current for infrequent switching: 100mA, withstand voltage 50VDC;

3. Normally open switch rated current: 25mA, withstand voltage 24VDC;

4. Contact resistance: (a) The initial value can reach 50m Ω; (b) The maximum value after the test is 100m Ω; 5. Insulation resistance: minimum 100m Ω, 500VDC;

6. Compressive strength: 500VAC/1 minute;

7. Interpolar capacitance: maximum 5pF;

8. Circuit: Single contact single selection: DS (S), DP (L).

In addition, the digital aspect of movies

DIP (Digital Image Processor) 2D Actual Image