Due to the increasing functional requirements of products, ordinary single panels can no longer meet the functional requirements. At this historic moment, double-sided printed PCB circuit boards have emerged, which means that there are wires on both sides of the circuit board, usually made of epoxy glass cloth copper clad plate for communication electronic equipment, advanced instruments The typical process for manufacturing double-sided perforated printed boards in fields such as high-performance electronic computers is the bare copper cladding solder mask process (SMOBC). The process is as follows:
Double sided copper clad plate cutting - CNC drilling inspection, deburring, brush chemical plating (through hole metallization) - (thin copper full plate electroplating) - screen printing negative electrode circuit pattern inspection and cleaning, Curing (dry film or wet method) film, exposure Development) - Check and repair circuit pattern electroplated tin (anti-corrosion nickel/gold) - Remove printed matter (photosensitive film) - Etch copper - (remove tin) Clean and brush a layer of heat cured green oil silk screen printed solder mask pattern (photosensitive dry or wet film, exposure, development, thermal curing, ordinary photosensitive heat) Curing and oil record curing - (tin spraying or organic solder mask) - Shape treatment, cleaning, drying, power switch testing, packaging inspection, Finished product shipment.
Assembled finished PCBA processed products
1、 Prepare materials, equipment, and tools required for circuit board assembly
1. One DC stabilized power supply and one multimeter;
2. Solder circuit board;
3. List of kits and shells of products to be assembled, as well as relevant accessories of the machine;
4. Electric screwdriver, cloth, electronic label (product identification code);
2、 Pre assembly inspection
1. Detailed inspection of the assembly list and circuit board inspection
2. Check the product casing
3. Check the product kit casing for defects and damage.
4. Check the printed board. Visually inspect whether the printed board is intact, whether the surface solder coating is intact, and whether there are obvious short circuits and short circuit defects. Use a multimeter to check for a short circuit between the power supply and ground on the printed board.
3、 Final assembly and shipment
1. The board with BGA and IC should use heat dissipation adhesive and anti-collision pads;
2. Align the printed boards and place them in the housing. Align the screw holes and be careful not to allow floating resistors and other components to collide with the casing;
3. Install the screws that secure the printed circuit board, cover the casing, and tighten the assembly screws;
4. Check the appearance for any damage or other visual defects;
5. Attach product labels;
6. Transfer to the backend, such as aging testing;
The entire PCBA assembly process is roughly as follows. If there are special process requirements, improvements can be made according to DFM related technical requirements
The above is the explanation provided by the editor of PCB circuit board company.
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