Introduce the relevant content and situation of printed circuit boards to help everyone improve their understanding. Let's read the following content together with the editor.
Printed circuit boards (PCBs) are convenient thin sheets used to accommodate interconnected electrical components in a simple, convenient, and economical manner. They are used as physical supports for installing and connecting different electrical components.
The PCB is made of glass fiber, composite epoxy resin or any other composite material, and has a metal coated surface. They have etching made of metals and acids to create circuits through different integrated circuits (ICs) and other components on circuit boards. Solder connects ICs and other components to the surface of the circuit board. The copper tracks in the circuit board reduce the possibility of short circuits, misalignment, or misaligned wires.
In this way, all components are firmly fixed to the circuit board without the need for complex wiring systems and unnecessary costs. This also simplifies the process of maintaining a PCB according to your needs - no need to handle a large number of wires.
However, not all electrical applications use standard PCBs. In fact, they vary depending on the size, shape, and function of electronic devices. For example, the type of PCB used in a smartwatch is different from the type used in a TV.
Designing a complex circuit is one aspect of the challenge, while transforming circuit design into PCB design is another aspect. This design must be well transformed into physical form in order to form the required circuit. A perfect PCB design is always the key to success in the manufacturing process, while an improperly designed PCB leads to waste of time and effort, rework, and product failure. Even worse, it may end up being useless and its results may not be relevant to real-world scenarios.
Therefore, a PCB designer must possess good knowledge of the manufacturing process in addition to having knowledge of positioning hundreds or thousands of components and traces that meet physical and electrical requirements.
PCB designers must follow the relevant standards of Design for Assembly (DFA) when designing PCBs. These standards refer to the cost and efficiency of the product, and provide the lowest risk, clarity, and simplification. For the overall situation of obtaining DFA, even assembler capabilities are important.
The substrate material fr4 is typically used to create normal and complex PCB designs, while polyamide material is used for high-speed RF capability design. When deciding on the selection of substrate materials, designers must have a deep understanding of the environmental conditions that PCB components can withstand.
Complex PCB designs may have special assembly requirements, such as mechanical component assembly, pressure fittings, adhesives, wiring harnesses, housing components, wiring harnesses, and test points. Therefore, designers must consider all these factors in order to organize the placement details of components accordingly.
The design concepts for all PCB design processes are the same, but they differ in terms of high-speed RF capabilities, as these designs must consider resistance, inductance, and capacitance, as well as traces and media that affect the number of signal increases and impedance to limit the upper frequency limit.
Similarly, the PCB design rules for wave soldering process also differ in the design of component orientation and pad shape. Obtaining the correct pad shape is primarily focused on fine pitch surface mount parts, while shadows are primarily focused on part positioning.
The reason for producing double-sided printed circuit boards is that complex components such as BGA, CSP, QFP, and DFN POP are placed at the top without direct contact with waves. If unavoidable, then the package should rotate 45 degrees relative to the direction of wave propagation.
The standards and specifications for the design performance and accessibility of polychlorinated biphenyls include IPC-2221, IPC-6011, and IPC-6012. Many PCB design software applications (PCB layout SW) can serve as windows based software packages, such as CAD SOFT, Eagle PCB, Novarm's DipTrace, and so on.
Benefiting from the transfer of global PCB production capacity to the mainland and the impact of downstream booming electronic terminal product manufacturing, the overall PCB market in Chinese Mainland shows a rapid development trend. From 2014 to 2019, the overall scale of PCB output value in Chinese Mainland showed a steady upward trend. Since 2019, Sino US economic and trade frictions have intensified, economic uncertainty has increased, and the PCB industry has fluctuated in the short term, but the medium - and long-term growth trend is still relatively certain. According to Prismark, the overall size of the Chinese PCB industry market is expected to grow to $42 billion by 2025.
PCB has the following functions in electronic devices.
(1) Provide mechanical support for fixing and assembling various electronic components such as integrated circuits, achieve wiring and electrical connections or insulation between various electronic components such as integrated circuits, and provide the required electrical characteristics.
(2) Provide solder mask graphics for automatic welding, and identification characters and graphics for component insertion, inspection, and maintenance.
(3) After using printed boards in electronic equipment, due to the consistency of similar printed boards, manual wiring errors are avoided, and electronic components can be automatically inserted or pasted, soldered, and inspected, ensuring the quality of electronic products, improving labor productivity, reducing costs, and facilitating maintenance.
(4) Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for circuits in high-speed or high-frequency circuits.
(5) The printed circuit board with embedded passive components provides certain electrical functions, simplifies electronic installation procedures, and improves product reliability.
(6) In large-scale and ultra large-scale electronic packaging components, it provides an effective chip carrier for miniaturized chip packaging of electronic components.
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