According to the disclosure of the Hong Kong Stock Exchange on June 9th, Shenzhen Chuangzhi Xinlian Technology Co., Ltd. ("Chuangzhi Xinlian") submitted a listing application to the Hong Kong Stock Exchange, with Haitong International, CCB International, and China Merchants Securities as joint sponsors, and Ernst&Young as the reporting accountant. The company had planned to go public on the A-share market and received listing guidance, but withdrew the guidance in May 2025 and ultimately chose to submit its application on the Hong Kong stock market.
The company is a leading provider of solutions for metalized interconnect coating materials and key process technologies in China. For nearly two decades, it has been committed to promoting wafer level and chip level packaging, as well as the development of the coating material supply chain in the PCB manufacturing field.
The company has long been committed to pioneering research on wet process coating materials and supporting processes in the semiconductor and PCB industries. In the field of electronic packaging, after more than ten years of product formulation and engineering experience accumulation, the company has become a leading provider of coating solutions for metalization and interconnect coating materials and key process technologies in China.
The company has developed a complete product matrix of chemical plating and electroplating materials, fully covering the application scenarios of wafer level packaging, chip level packaging, and PCB manufacturing. The overall performance of the company's main coating materials has reached the international advanced level, with multiple key performance indicators exceeding global industry standards.
