Name: FPGA PCB Assembly Chip Manufacturer
Number of SMT lines: 7 high-speed SMT patch matching production lines
SMT daily production capacity: over 30 million points
Testing equipment: X-RAY detector, first article detector, AOI automatic optical detector, ICT detector, BGA repair bench
Installation speed: Chip component installation speed (optimal state) 0.036 S/chip
Minimum packaging that can be pasted: 0201, with an accuracy of ± 0.04mm
Minimum device accuracy: can mount devices such as PLCC, QFP, BGA, CSP, etc., with pin spacing up to ± 0.04mm
IC type chip placement accuracy: The placement of ultra-thin PCB boards, FPC PCB boards, gold fingers, etc. has a high level of accuracy. High difficulty products such as TFT display driver board, mobile phone motherboard, battery protection circuit, etc. that can be mounted/inserted/mixed
Development Board Features
