Name: Semiconductor Solution Multimedia Motherboard BGA Assembly

Number of SMT lines: 7 high-speed SMT patch matching production lines

SMT daily production capacity: over 30 million points

Testing equipment: X-RAY detector, first piece detector, AOI automatic optical detector, ICT detector, BGA repair bench

Installation speed: Chip component installation speed (optimal state) 0.036 S/piece

Minimum packaging that can be pasted: 0201, with an accuracy of ± 0.04mm

Minimum device accuracy: can mount devices such as PLCC, QFP, BGA, CSP, etc., with pin spacing up to ± 0.04mm

IC type chip placement accuracy: The placement of ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. has a high level of accuracy. High difficulty products such as TFT display driver board, mobile phone motherboard, battery protection circuit, etc. that can be mounted/inserted/mixed

Due to the continuous development of the technological world and its applications in various fields, the printed circuit board (PCB) business has expanded its irresistible beneficial impact. In recent years, its impact on the electronic world has exceeded all predictions, including IoT devices, smartphones, computers, artificial intelligence, and more.