Name: Air conditioning controller DIP processing

Number of SMT lines: 7 high-speed SMT patch matching production lines

SMT daily production capacity: over 30 million points

Testing equipment: X-RAY, first article tester, AOI optical tester, ICT tester, BGA repair bench

Installation speed: Installation speed of chip components (optimal state) 0.036 S/piece

Minimum packaging that can be pasted: 0201, with an accuracy of ± 0.04mm

Minimum device accuracy: can mount devices such as PLCC, QFP, BGA, CSP, etc., with pin spacing up to ± 0.04mm

IC type chip mounting accuracy: It has a high level of mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc., and can be used to mount/insert/mix TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Dip in package can also be called dual in-line package technology. Refers to integrated circuit chips packaged in a dual inline format during impregnation operation by PCB factory PCBA. At present, most small and medium-sized integrated circuits adopt this packaging method, with generally no more than 100 pins; The CPU chip in a DIP package has two rows of pins that need to be inserted into a chip socket with a DIP structure, or directly soldered onto a PCB board with the same number of solder holes and geometric arrangement.

DIP packaged chips must be carefully inserted and removed from the chip socket to avoid damaging the pins during SMT technician processing. The DIP packaging structure forms include: multi-layer ceramic dual inline DIP, single-layer ceramic dual inline DIP, lead frame DIP (including glass ceramic sealing type, plastic packaging structure type, ceramic low melting point glass packaging type), etc.