Name: Module patch plugin processing

PCB type: PCB circuit board

Dielectric: FR-4

Material: Glass fiber epoxy resin

Application: Consumer Electronics

Resistance performance: V0

Mechanical rigidity: rigidity

Processing technology: electrolytic foil

Base material: copper

Insulation material: organic resin

Quality level: IPC Class 2, Ipc Class 3

Laminate brands: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers

PCB layers: 1-30 layers

Plate thickness: 0.1-8.0mm Plate thickness

Tolerance: ± 0.1mm/± 10%

Surface treatment: OSP, HASL, HASL Lf, sinking gold, etc.

Color of solder mask layer: green, red, white, black, blue, yellow, orange

Screen printing colors: black, white, yellow, etc

Electrical testing: fixtures/flying needles, others

Testing: AOI, X-ray (Au&Ni), controllable impedance testing

In PCBA processing, with the increasing strength of SMT processing equipment and the smaller size of PCBs and electronic components, SMT chip processing is becoming increasingly popular, and SMT chip processing is gradually replacing the previous plug-in processing. However, some circuit boards still require plug-in processing. Currently, plug-in processing is still common in the electronic processing industry, and DIP plug-in processing in SMD processing is completed.

Dual In line Package, also known as dual in-line package technology, refers to the dual in-line package form of integrated circuit chips, which is adopted by the vast majority of small and medium-sized integrated circuits, with the number of pins generally not more than 100