Promote the improvement of the performance of high-speed communication network equipment

AGC Inc., a leading global manufacturer of glass, chemicals, and other high-tech materials, President: Yoshinori Hirai， Tokyo Stock Exchange code: 5201) has released "METEORWAVE ®  The ELL series multi-layer printed circuit board (PCB) materials have achieved industry-leading levels of low transmission loss and high thermal resistance for high-speed communication applications. METEORWAVE ®  The ELL series is beneficial for improving the capacity and transmission rate of data communication and reducing power consumption, thus meeting the requirements of the rapid increase in data communication volume in the future driven by technological advances such as the Internet of Things, DX, and generative artificial intelligence.

METEORWAVE ®  ELL series (Photo: Business Wire)

Low transmission loss is one of the key factors in improving the performance of high-speed communication network devices such as artificial intelligence servers and routers. As transmission losses decrease, the flow of electrical signals through the circuits in the device becomes more efficient, allowing for faster processing of large amounts of data and reduced power consumption. However, reducing transmission loss usually leads to a decrease in thermal resistance. In addition, as high-speed communication network equipment must operate in high-temperature environments, the multi-layer PCB materials used in its components must also have high thermal resistance.

The "METEORWAVE" released by AGC ®  The ELL series multi-layer PCB materials are developed through the collaborative application of AGC's rich glass and resin material technology, as well as composite material technology, achieving high reliability in high-temperature environments. This series has passed UL-94 V0 certification * 2 in the United States.

According to AGC Group's mid-term business plan AGC plus-2026, electronic business is a strategic business. The group will ensure the implementation of high-speed communication networks through multi-layer PCB materials, thereby promoting the further development of the Internet of Things, DX, and generative artificial intelligence.

*Research based on AGC.

*The certification standards of UL Solutions, an independent safety science organization in the United States that specializes in safety and quality certification.